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1 features applications description bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 www.ti.com overvoltage and overcurrent protection ic and li+ charger front-end protection ic enable function 2 provides protection for three variables: small 2 mm 2 mm 8-pin son package ? input overvoltage ldo mode voltage regulation options: ? input overcurrent with current limiting ? 5.5v on bq24300 ? battery overvoltage ? 4.5v on bq24304 30v maximum input voltage optional input reverse polarity protection bluetooth headsets high immunity against false triggering due to low-power handheld devices voltage spikes robust against false triggering due to current transients thermal shutdown the bq24300 and bq24304 are highly integrated circuits designed to provide protection to li-ion batteries from failures of the charging circuit. the ic continuously monitors the input voltage, the input current, and the battery voltage. the device operates like a linear regulator: for voltages up to the input overvoltage threshold, the output is held at 5.5v (bq24300) or 4.5v (bq24304). in case of an input overvoltage condition, if the overvoltage condition persists for more than a few microseconds, the ic removes power from the charging circuit by turning off an internal switch. in the case of an overcurrent condition, it limits the current to a safe value for a blanking duration before turning the switch off. additionally, the ic also monitors its own die temperature and switches off if it becomes too hot. the ic also offers optional protection against reverse voltage at the input with an external p-channel mosfet. pinout application schematic 1 please be aware that an important notice concerning availability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 powerpad is a trademark of texas instruments. production data information is current as of publication date. copyright ? 2007, texas instruments incorporated products conform to specifications per the terms of the texas instruments standard warranty. production processing does not necessarily include testing of all parameters. pgate vss nc in outce bq24300 bq24304 nc 1 23 4 5 6 7 8 vbat vss vdc gnd ac adapter system 1 f 1 f out in vbat chargeric bq24080 1 bq24300 ce 2 5 8 6 100k w
package dissipation ratings absolute maximum ratings (1) recommended operating conditions bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 these devices have limited built-in esd protection. the leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the mos gates. ordering information (1) device (2) output regulation voltage package marking bq24300 5.5v 2mm x 2mm son bza bq24304 4.5v 2mm x 2mm son cbs (1) for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti website at www.ti.com. (2) to order a 3000 pcs reel add r to the part number, or to order a 250 pcs reel add t to the part number. package r jc r ja (1) dsg 5 c/w 75 c/w (1) this data is based on using the jedec high-k board and the exposed die pad is connected to a cu pad on the board. the pad is connected to the ground plane by a 2x3 via matrix. over operating free-air temperature range (unless otherwise noted) parameter pin value unit in, pgate (with respect to vss) ? 0.3 to 30 v input voltage out (with respect to vss) ? 0.3 to 12 v ce, vbat (with respect to vss) ? 0.3 to 7 v all (human body model per jesd22-a114-e) 2000 v all (machine model per jesd22-a115-a) 200 v esd withstand voltage all (charged device model per jesd22-c101-c) 500 v in (iec 61000-4-2) (with in pin bypassed to vss with 1.0- f low-esr 15 (air discharge) 8 kv ceramic capacitor) (contact) junction temperature, t j ? 40 to 150 c storage temperature, t stg ? 65 to 150 c lead temperature (soldering, 10 seconds) 300 c (1) stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. these are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. over operating free-air temperature range (unless otherwise noted) min max unit v in input voltage range 3.3 30 v t j junction temperature 0 125 c 2 submit documentation feedback copyright ? 2007, texas instruments incorporated product folder link(s): bq24300 bq24304 www.ti.com
electrical characteristics bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 over junction temperature range 0 c t j 125 c and recommended supply voltage (unless otherwise noted) parameter test conditions min typ max unit power-on-reset v uvlo under-voltage lock-out, input ce = low, v in increasing from 0v to 3v 2.5 2.7 2.8 v power detected threshold v hys-uvlo hysteresis on uvlo ce = low, v in decreasing from 3v to 0v 200 260 300 mv t dgl(pgood) deglitch time, input power ce = low, time measured from 8 ms detected status v in 0v 4v 1 s rise time, to output turning on in bq24300 340 400 operating i dd v in = 5v, ce = low, no load on out pin a current bq24304 410 500 i stdby standby current ce = high, v in = 5v 65 95 a input to output characteristics v do drop-out voltage in to out ce = low, v in = 4 v, i out = 250 ma 45 75 mv output voltage regulation bq24300 5.30 5.5 5.70 v o(reg) output voltage ce = low, v in = 6 v, i out = 250 ma v bq24304 4.36 4.5 4.64 input overvoltage protection input overvoltage protection ce = low, v in increasing from 4v to 12v v ovp 10.2 10.5 10.8 v threshold v hys-ovp hysteresis on ovp ce = low, v in decreasing from 12v to 4v 60 110 160 mv blanking time, on ovp ce = low, time measured from t blank(ovp) 64 s v in 4v 12v, 1 s rise time, to output turning off recovery time from input ce = low, time measured from t on(ovp) 8 ms overvoltage condition v in 12v 4v, 1 s fall time, to output turning on input overcurrent protection input overcurrent protection i ocp ce = low, v in = 5 v 250 300 350 ma range blanking time, input ce = low t blank(ocp) 5 ms overcurrent detected recovery time from input ce = low t rec(ocp) 64 ms overcurrent condition battery overvoltage protection battery overvoltage protection ce = low, v in > 4.3v, v vbat increasing bv ovp 4.30 4.35 4.40 v threshold from 4.2 v to 4.5 v hysteresis on bv ovp ce = low, v in > 4.3v, v vbat decreasing v hys-bovp 200 275 320 mv from 4.5 v to 3.9 v input bias current on vbat v vbat = 4.4 v, t j = 25 c i vbat 10 na pin deglitch time, battery ce = low, v in > 4.4v, time measured from t dgl(bovp) 176 s overvoltage detected v vbat 4.2v 4.5v, 1 s rise time to output turning off p-fet gate driver v gclmp gate driver clamp voltage v in > 15v 13 14 15 v thermal protection thermal shutdown t j(off) 140 150 c temperature t j(off-hys) thermal shutdown hysteresis 20 c logic levels on ce v il low-level input voltage 0 0.4 v v ih high-level input voltage 1.4 v i il low-level input current 1 a i ih high-level input current v ce = 1.8v 15 a copyright ? 2007, texas instruments incorporated submit documentation feedback 3 product folder link(s): bq24300 bq24304 www.ti.com
bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 figure 1. simplified block diagram 4 submit documentation feedback copyright ? 2007, texas instruments incorporated product folder link(s): bq24300 bq24304 www.ti.com out vss thermal shutdown ce control and status vbat v ref v - ref d vi sns vi sns off v ref charge pump,bandgap, bias gen v ref pgate v in v gclmp in t blank(ocp) t blank(ovp) v ref t dgl(pgood) t dgl(bovp) q1 v ref v loop o(reg) current limiting loop ocp comparator v ref uvlo v in v in ovp comparator level shift
terminal functions bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 terminal i/o description name no. in 1 i input power, connect to external dc supply. connect external 0.1 f (minimum) ceramic capacitor to vss 8 o output terminal to the charging system. connect external 1 f capacitor (minimum) ceramic capacitor to out vss pgate 3 o gate drive for optional external p-fet vbat 6 i battery voltage sense input. connect to pack positive terminal through a resistor. ce 5 i chip enable input. active low. when ce = hi, the input fet is off. internally pulled down. vss 2 ? ground terminal nc 4, 7 do not connect to any external circuit. these pins may have internal connections used for test purposes. there is an internal electrical connection between the exposed thermal pad and the vss pin of the device. the thermal pad must be connected to the same potential as the vss pin on the printed circuit board. do thermal pad ? not use the thermal pad as the primary ground input for the device. vss pin must be connected to ground at all times. copyright ? 2007, texas instruments incorporated submit documentation feedback 5 product folder link(s): bq24300 bq24304 www.ti.com vbat pgate vss nc in outce 1 2 3 6 8 7 bq24300bq24304 4 5 nc
typical operating performance bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 test conditions (unless otherwise noted) for typical operating performance are: v in = 5 v, c in = 1 f, c out = 1 f, r bat = 100 k ? , r out = 22 ? , t a = 25 c (see figure 22 - typical application circuit) figure 2. normal power-on showing soft-start. figure 3. power-on with input overvoltage. v in 0 v to 6.0 v, t r = 20 s v in 0 v to 12.0 v, t r = 50 s figure 4. bq24300 ovp response for input step. figure 5. bq24300 ovp response for input step. v in 6.0 v to 10.3 v, t r = 2 s. shows immunity to ringing v in 6.0 v to 11.0 v, t r = 5 s. shows ovp blanking time 6 submit documentation feedback copyright ? 2007, texas instruments incorporated product folder link(s): bq24300 bq24304 www.ti.com i out v out v in v out i out v in t dgl(pgood) v in v out 12.8v 11.5v 5.92v v in v out 5.9v t blank(ovp)
typical operating performance bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 figure 6. out pin response to slow input ramp figure 7. bq24300 recovery from input ovp. v in 11.0 v to 5.0 v, t f = 400 s figure 8. ocp, powering up with out pin shorted to vss figure 9. ocp, showing current limiting and ocp blanking. r out 22 ? to 13 ? for 2.6 ms to 22 ? figure 10. ocp, showing current limiting and figure 11. zoom-in on turn-off region of figure 10, ocp blanking. r out 22 ? to 13 ? showing soft-stop copyright ? 2007, texas instruments incorporated submit documentation feedback 7 product folder link(s): bq24300 bq24304 www.ti.com v in v out v < v in uvlo v < v in o(reg) v < v in ovp t on(ovp) v in v out r = 22 out w r = 13 out w i out v out i limited to 300ma out v in v out i out t rec(ocp) t blank(ocp) r = 22 out w r = 13 out w v out i out i limited to 300ma out t blank(ocp) v out i out
bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 typical operating performance (continued) figure 12. battery ovp. v vbat steps from 4.3 v to 4.5 v. shows t dgl(bovp) and soft-stop undervoltage lockout dropout voltage (in to out) vs vs free-air temperature free-air temperature figure 13. figure 14. regulation voltage (out pin) ovp threshold vs vs free-air temperature free-air temperature figure 15. figure 16. 8 submit documentation feedback copyright ? 2007, texas instruments incorporated product folder link(s): bq24300 bq24304 www.ti.com 20 30 40 50 60 70 80 0 50 100 150 bq24304, v = 4 v in v do @ 250ma - mv temperature - c bq24300, v = 5 v in 5.49 5.5 5.51 5.52 5.53 0 20 40 60 80 bq24304 bq24300 v bq24300 - v o(reg ) temperature - c v bq24304 - v o(reg ) 4.4 4.5 4.51 4.52 4.53 100 120 10.3 10.35 10.4 10.45 10.5 10.6 0 20 40 60 80 100 120 v increasing in v decreasing in temperature - c v , v - v ovp hys-ovp 10.55 v out v vbat t dgl(bovp) 2.4 2.45 2.5 2.55 2.6 2.65 2.7 2.75 -50 -30 -10 10 30 50 70 90 110 130 v increasing in v decreasing in temperature - c v , v - v uvlo h ys-uvlo
bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 typical operating performance (continued) ocp threshold battery ovp thresholds vs vs free-air temperature free-air temperature figure 17. figure 18. leakage current (bat pin) supply current vs vs free-air temperature input voltage figure 19. figure 20. copyright ? 2007, texas instruments incorporated submit documentation feedback 9 product folder link(s): bq24300 bq24304 www.ti.com 4.05 4.1 4.15 4.2 4.25 4.3 4.35 4.4 -50 -30 -10 10 30 50 70 90 110 130 bv (v increasing) ovp vbat bat-ovp recovery (v decreasing) vbat bv - v ovp temperature - c 285 290 295 300 305 310 315 0 20 40 60 80 100 120 i - ma ocp temperature - c 0 100 200 300 400 500 600 700 800 900 0 5 10 15 20 25 30 35 i , i - a dd st dby m v - v in ce = l ce = h 0 0.5 1 1.5 2 2.5 0 20 40 60 80 100 120 temperature - c i - na vbat
bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 typical operating performance (continued) pgate voltage vs input voltage figure 21. 10 submit documentation feedback copyright ? 2007, texas instruments incorporated product folder link(s): bq24300 bq24304 www.ti.com 0 2 4 6 8 10 12 14 16 18 0 5 10 15 20 25 30 35 v - v pg ate v - v in
typical application circuits bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 figure 22. overvoltage, overcurrent, and battery overvoltage protection figure 23. ovp, ocp, batovp with input reverse-polarity protection copyright ? 2007, texas instruments incorporated submit documentation feedback 11 product folder link(s): bq24300 bq24304 www.ti.com 8 2 vss vdc gnd ac adapter system 1 f 1 f out in 6 vbat chargeric bq24080 1 bq24300 5 ce 100k c out c in r bat 1 8 2 vss pgate vdc gnd ac adapter system 1 f 1 f out in 6 vbat chargeric bq24080 3 bq24300 5 ce 100k w 100k w q ext r bat 47k w r ce
detailed functional description power down power-on reset operation input overvoltage protection input overcurrent protection battery overvoltage protection bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 the bq24300 and bq24304 are highly integrated circuits designed to provide protection to li-ion batteries from failures of the charging circuit. the ic continuously monitors the input voltage, the input current and the battery voltage, and protects down-stream circuitry from damage if any of these parameters exceeds safe values. the ic also monitors its own die temperature and switches off if it becomes too hot. the ic also offers optional protection against reverse voltage at the input with an external p-channel mosfet. the device remains in power down mode when the input voltage at the in pin is below the under-voltage threshold v uvlo . the fet q1 (see figure 1 ) connected between in and out pins is off. the device resets all internal timers when the input voltage at the in pin exceeds the uvlo threshold. the gate driver for the external p-fet is enabled. the ic then waits for duration t dgl(pgood) for the input voltage to stabilize. if, after t dgl(pgood) , the input voltage and battery voltage are safe, fet q1 is turned on. the ic has a soft-start feature to control the inrush current. this soft-start minimizes voltage ringing at the input (the ringing occurs because the parasitic inductance of the adapter cable and the input bypass capacitor form a resonant circuit). figure 2 shows the power-up behavior of the device. because of the deglitch time at power-on, if the input voltage rises rapidly to beyond the ovp threshold, the device will not switch on at all, as shown in figure 3 . the device continuously monitors the input voltage, the input current and the battery voltage as described in detail in the following sections: as long as the input voltage is less than v o(reg) , the output voltage tracks the input voltage (less the drop caused by r ds on of q1). if the input voltage is greater than v o(reg) (plus the r ds on drop) and less than v ovp , the device acts like a series linear regulator, with the output voltage regulated to v o(reg) . if the input voltage rises above v ovp , the output voltage is clamped to v o(reg) for a blanking duration t blank(ovp) . if the input voltage returns below v ovp within t blank(ovp) , the device continues normal operation (see figure 4 ). this provides protection against turning power off due to transient overvoltage spikes while still protecting the system. however, if the input voltage remains above v ovp for more than t blank(ovp) , the internal fet is turned off, removing power from the circuit (see figure 5 ). when the input voltage comes back to a safe value, the device waits for t on(ovp) then switches on q1 and goes through the soft-start routine (see figure 7 ). figure 6 describes graphically the behavior of the out pin over the entire range of input voltage variation. the device can supply load current up to i ocp continuously. if the load current tries to exceed this threshold, the current is limited to i ocp for a maximum duration of t blank(ocp) . if the load current returns to less than i ocp before t blank(ocp) times out, the device continues to operate (see figure 9 ). however, if the overcurrent situation persists for t blank(ocp) , fet q1 is turned off for a duration of t rec(ocp) . it is then turned on again and the current is monitored all over again (see figure 10 and figure 8 ). to prevent the input voltage from spiking up due to the inductance of the input cable, q1 is not turned off rapidly in an overcurrent fault condition. instead, the gate drive of q1 is reduced slowly, resulting in a ? soft-stop ? , as shown in figure 11 . the battery overvoltage threshold bv ovp is internally set to 4.35v. if the battery voltage exceeds the bv ovp threshold for longer than t dgl(bovp) , fet q1 is turned off (see figure 12 ). this switch-off is also a soft-stop. q1 is turned on (soft-start) once the battery voltage drops to bv ovp ? v hys-bovp . 12 submit documentation feedback copyright ? 2007, texas instruments incorporated product folder link(s): bq24300 bq24304 www.ti.com
thermal protection enable function pgate pin bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 if the junction temperature of the device exceeds t j(off) , fet q1 is turned off. the fet is turned back on when the junction temperature falls below t j(off) ? t j(off-hys) . the ic has an enable pin which can be used to enable or disable the device. when the ce pin is driven high, the internal fet is turned off. when the ce pin is low, the fet is turned on if other conditions are safe. the ce pin has an internal pull-down resistor of 200 k (typical) and can be left floating. when used with an external p-channel mosfet, in addition to ovp, ocp and battery-ovp, the device offers protection against input reverse polarity up to ? 30v. when operating with normal polarity, the ic first turns on due to current flow through the body-diode of the fet q ext . the pgate pin then goes low, turning on q ext . for input voltages larger than v gclmp , the voltage on the pgate pin is driven to v in ? v gclmp . this ensures that the gate to source voltage seen by q ext does not exceed ? v gclmp . copyright ? 2007, texas instruments incorporated submit documentation feedback 13 product folder link(s): bq24300 bq24304 www.ti.com
bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 figure 24. flow diagram 14 submit documentation feedback copyright ? 2007, texas instruments incorporated product folder link(s): bq24300 bq24304 www.ti.com any state if v < v in uvlo , go to power down power down all ic functions off v > v ? in uvlo no yes reset timers reset q1 off turn on pgate ce = low ? no v < v ? in ovp yes no turn off q1 i < i ? ocp yes no wait t rec(ocp) v < bv ? vbat ovp no turn on q1 turn off q1 turn off q1 yes yes no turn off q1 t < t ? j j(off)
application information selection of r bat : selection of r ce : selection of input and output bypass capacitors: pcb layout guidelines: bq24300 bq24304 slus764a ? august 2007 ? revised october 2007 it is strongly recommended that the battery not be tied directly to the vbat pin of the device, as under some failure modes of the ic, the voltage at the in pin may appear on the vbat pin. this voltage can be as high as 30v, and applying 30v to the battery in case of the failure of the device can be hazardous. connecting the vbat pin through r bat prevents a large current from flowing into the battery in case of failure of the ic. in the interests of safety, r bat should have a very high value. the problem with a large r bat is that the voltage drop across this resistor because of the vbat bias current i vbat causes an error in the bv ovp threshold. this error is over and above the tolerance on the nominal 4.35v bv ovp threshold. choosing r bat in the range 100k to 470k is a good compromise. in the case of ic failure, with r bat equal to 100k , the maximum current flowing into the battery would be (30v ? 3v) 100k = 246 a, which is low enough to be absorbed by the bias currents of the system components. r bat equal to 100k would result in a worst-case voltage drop of r bat x i vbat 1mv. this is negligible compared to the internal tolerance of 50mv on the bv ovp threshold. if the bat-ovp function is not required, the vbat pin should be connected to vss. the ce pin can be used to enable and disable the ic. if host control is not required, the ce pin can be tied to ground or left un-connected, permanently enabling the device. in applications where external control is required, the ce pin can be controlled by a host processor. as in the case of the vbat pin (see above), the ce pin should be connected to the host gpio pin through as large a resistor as possible. the limitation on the resistor value is that the minimum v oh of the host gpio pin less the drop across the resistor should be greater than v ih of the bq2430x ce pin. the drop across the resistor is given by r ce x i ih . the input capacitor c in in figure 22 and figure 23 is for decoupling, and serves an important purpose. whenever there is a step change downwards in the system load current, the inductance of the input cable causes the input voltage to spike up. c in prevents the input voltage from overshooting to dangerous levels. it is strongly recommended that a ceramic capacitor of at least 1 f be used at the input of the device. it should be located in close proximity to the in pin. c out in figure 23 is also important: if a very fast (< 1 s rise-time) overvoltage transient occurs at the input, the current that charges c out causes the device ? s current-limiting loop to kick in, reducing the gate-drive to fet q1. this results in improved performance for input overvoltage protection. c out should also be a ceramic capacitor of at least 1 f, located close to the out pin. c out also serves as the input decoupling capacitor for the charging circuit downstream of the protection ic. 1. this device is a protection device, and is meant to protect down-stream circuitry from hazardous voltages. potentially, high voltages may be applied to this ic. it has to be ensured that the edge-to-edge clearances of pcb traces satisfy the design rules for the maximum voltages expected to be seen in the system. 2. the device uses son packages with a powerpad?. for good thermal performance, the powerpad should be thermally coupled with the pcb ground plane. in most applications, this will require a copper pad directly under the ic. this copper pad should be connected to the ground plane with an array of thermal vias. 3. c in and c out should be located close to the ic. other components like r bat should also be located close to the ic. copyright ? 2007, texas instruments incorporated submit documentation feedback 15 product folder link(s): bq24300 bq24304 www.ti.com
packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) bq24300dsgr active son dsg 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year bq24300dsgrg4 active son dsg 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year BQ24300DSGT active son dsg 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year BQ24300DSGTg4 active son dsg 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year bq24304dsgr active son dsg 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year bq24304dsgrg4 active son dsg 8 3000 green (rohs & no sb/br) cu nipdau level-2-260c-1 year bq24304dsgt active son dsg 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year bq24304dsgtg4 active son dsg 8 250 green (rohs & no sb/br) cu nipdau level-2-260c-1 year (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 19-nov-2007 addendum-page 1
tape and reel box information device package pins site reel diameter (mm) reel width (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant bq24300dsgr dsg 8 site 48 179 8 2.2 2.2 1.2 4 8 q2 bq24304dsgr dsg 8 site 48 179 8 2.2 2.2 1.2 4 8 q2 package materials information www.ti.com 3-nov-2007 pack materials-page 1
device package pins site length (mm) width (mm) height (mm) bq24300dsgr dsg 8 site 48 195.0 200.0 45.0 bq24304dsgr dsg 8 site 48 195.0 200.0 45.0 package materials information www.ti.com 3-nov-2007 pack materials-page 2

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